Part #: W9825G2JB-6
Part Category: Memory ICs
Manufacturer: Winbond Electronics Corporation America
Description: Synchronous DRAM, 8MX32, 5ns, CMOS, PBGA90
Manufacturer: Winbond Electronics Corporation America
Description: Synchronous DRAM, 8MX32, 5ns, CMOS, PBGA90
SPECIFICATIONS
Mfr Package Description | TFBGA-90 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
China RoHS Compliant | Yes |
Status | NRFND |
Sub Category | DRAMs |
Access Mode | FOUR BANK PAGE BURST |
Access Time-Max | 5.0 ns |
Clock Frequency-Max (fCLK) | 166.0 MHz |
Interleaved Burst Length | 1,2,4,8 |
I/O Type | COMMON |
JESD-30 Code | R-PBGA-B90 |
Memory Density | 2.68435456E8 bit |
Memory IC Type | SYNCHRONOUS DRAM |
Memory Width | 32 |
Number of Functions | 1 |
Number of Ports | 1 |
Number of Terminals | 90 |
Number of Words | 8388608.0 words |
Number of Words Code | 8M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Min | 0.0 Cel |
Operating Temperature-Max | 70.0 Cel |
Organization | 8MX32 |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA |
Package Equivalence Code | BGA90,9X15,32 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Qualification Status | Not Qualified |
Refresh Cycles | 4096.0 |
Seated Height-Max | 1.2 mm |
Self Refresh | YES |
Sequential Burst Length | 1,2,4,8,FP |
Standby Current-Max | 0.004 Amp |
Supply Current-Max | 0.15 Amp |
Supply Voltage-Nom (Vsup) | 3.3 V |
Supply Voltage-Min (Vsup) | 3.0 V |
Supply Voltage-Max (Vsup) | 3.6 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Form | BALL |
Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 13.0 mm |
Width | 8.0 mm |
Additional Feature | AUTO/SELF REFRESH |