Part #: W9825G2JB-6

Part Category: Memory ICs
Manufacturer: Winbond Electronics Corporation America
Description: Synchronous DRAM, 8MX32, 5ns, CMOS, PBGA90

SPECIFICATIONS

Mfr Package Description TFBGA-90
REACH Compliant Yes
EU RoHS Compliant Yes
China RoHS Compliant Yes
Status Active
Sub Category DRAMs
Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.0  ns
Clock Frequency-Max (fCLK) 166.0  MHz
Interleaved Burst Length 1,2,4,8
I/O Type COMMON
JESD-30 Code R-PBGA-B90
Memory Density 2.68435456E8  bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 32
Number of Functions 1
Number of Ports 1
Number of Terminals 90
Number of Words 8388608.0  words
Number of Words Code 8M
Operating Mode SYNCHRONOUS
Operating Temperature-Min 0.0  Cel
Operating Temperature-Max 70.0  Cel
Organization 8MX32
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA90,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 4096.0
Seated Height-Max 1.2  mm
Self Refresh YES
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max 0.004  Amp
Supply Current-Max 0.15  Amp
Supply Voltage-Nom (Vsup) 3.3  V
Supply Voltage-Min (Vsup) 3.0  V
Supply Voltage-Max (Vsup) 3.6  V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Length 13.0  mm
Width 8.0  mm
Additional Feature AUTO/SELF REFRESH