Part #: W9825G2JB-6
Part Category: Memory ICs
Manufacturer: Winbond Electronics Corporation America
Description: Synchronous DRAM, 8MX32, 5ns, CMOS, PBGA90
Manufacturer: Winbond Electronics Corporation America
Description: Synchronous DRAM, 8MX32, 5ns, CMOS, PBGA90
SPECIFICATIONS
| Mfr Package Description | TFBGA-90 |
| REACH Compliant | Yes |
| EU RoHS Compliant | Yes |
| China RoHS Compliant | Yes |
| Status | NRFND |
| Sub Category | DRAMs |
| Access Mode | FOUR BANK PAGE BURST |
| Access Time-Max | 5.0 ns |
| Clock Frequency-Max (fCLK) | 166.0 MHz |
| Interleaved Burst Length | 1,2,4,8 |
| I/O Type | COMMON |
| JESD-30 Code | R-PBGA-B90 |
| Memory Density | 2.68435456E8 bit |
| Memory IC Type | SYNCHRONOUS DRAM |
| Memory Width | 32 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Terminals | 90 |
| Number of Words | 8388608.0 words |
| Number of Words Code | 8M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 70.0 Cel |
| Organization | 8MX32 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA |
| Package Equivalence Code | BGA90,9X15,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Refresh Cycles | 4096.0 |
| Seated Height-Max | 1.2 mm |
| Self Refresh | YES |
| Sequential Burst Length | 1,2,4,8,FP |
| Standby Current-Max | 0.004 Amp |
| Supply Current-Max | 0.15 Amp |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Supply Voltage-Min (Vsup) | 3.0 V |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 13.0 mm |
| Width | 8.0 mm |
| Additional Feature | AUTO/SELF REFRESH |
