Part #: W971GG6KB-25

Part Category: Memory ICs
Manufacturer: Winbond Electronics Corporation America
Description: DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84

SPECIFICATIONS

Mfr Package Description 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84
REACH Compliant Yes
EU RoHS Compliant Yes
China RoHS Compliant Yes
Status Active
Sub Category DRAMs
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.4  ns
Clock Frequency-Max (fCLK) 400.0  MHz
Interleaved Burst Length 4,8
I/O Type COMMON
JESD-30 Code R-PBGA-B84
Memory Density 1.073741824E9  bit
Memory IC Type DDR DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 84
Number of Words 6.7108864E7  words
Number of Words Code 64M
Operating Mode SYNCHRONOUS
Operating Temperature-Min 0.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 64MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA84,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 8192.0
Seated Height-Max 1.2  mm
Self Refresh YES
Sequential Burst Length 4,8
Standby Current-Max 0.008  Amp
Supply Current-Max 0.185  Amp
Supply Voltage-Nom (Vsup) 1.8  V
Supply Voltage-Min (Vsup) 1.7  V
Supply Voltage-Max (Vsup) 1.9  V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Length 12.5  mm
Width 8.0  mm
Additional Feature AUTO/SELF REFRESH