Part #: W78M32VP110BM

Part Category: Memory ICs
Manufacturer: Microsemi Corp.
Description: Flash, 8MX32, 110ns, PBGA159

SPECIFICATIONS

Mfr Package Description 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
Status Transferred
Type NOR TYPE
Sub Category Flash Memories
Access Time-Max 110.0  ns
Data Polling YES
JESD-30 Code R-PBGA-B159
Memory Density 2.68435456E8  bit
Memory IC Type FLASH
Memory Width 32
Number of Functions 1
Number of Sectors/Size 128
Number of Terminals 159
Number of Words 8388608.0  words
Number of Words Code 8M
Operating Mode ASYNCHRONOUS
Operating Temperature-Min -55.0  Cel
Operating Temperature-Max 125.0  Cel
Organization 8MX32
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA159,10X16,50
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Ready/Busy YES
Standby Current-Max 2.0E-5  Amp
Supply Current-Max 0.36  Amp
Supply Voltage-Nom (Vsup) 3.3  V
Supply Voltage-Min (Vsup) 3.0  V
Supply Voltage-Max (Vsup) 3.6  V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Pitch 1.27  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit YES
Write Protection HARDWARE/SOFTWARE