Part #: W3H64M72E-667SBC

Part Category: Memory ICs
Manufacturer: Microsemi Corp.
Description: DDR DRAM, 64MX72, 0.5ns, CMOS, PBGA208

SPECIFICATIONS

Mfr Package Description 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
Status Discontinued
Sub Category DRAMs
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.5  ns
Clock Frequency-Max (fCLK) 333.0  MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B208
Memory Density 4.831838208E9  bit
Memory IC Type DDR DRAM
Memory Width 72
Number of Functions 1
Number of Ports 1
Number of Terminals 208
Number of Words 6.7108864E7  words
Number of Words Code 64M
Operating Mode SYNCHRONOUS
Operating Temperature-Min 0.0  Cel
Operating Temperature-Max 70.0  Cel
Organization 64MX72
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA208,11X19,40
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Refresh Cycles 8192.0
Self Refresh YES
Supply Current-Max 2.2  Amp
Supply Voltage-Nom (Vsup) 1.8  V
Supply Voltage-Min (Vsup) 1.7  V
Supply Voltage-Max (Vsup) 1.9  V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1.0  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Additional Feature AUTO/SELF REFRESH