Part #: W3H64M72E-533SBM

Part Category: Memory ICs
Manufacturer: Microsemi Corp.
Description: DDR DRAM, 64MX72, 0.5ns, CMOS, PBGA208

SPECIFICATIONS

Mfr Package Description 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
Status Discontinued
Sub Category DRAMs
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.5  ns
Clock Frequency-Max (fCLK) 267.0  MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B208
Memory Density 4.831838208E9  bit
Memory IC Type DDR DRAM
Memory Width 72
Number of Functions 1
Number of Ports 1
Number of Terminals 208
Number of Words 6.7108864E7  words
Number of Words Code 64M
Operating Mode SYNCHRONOUS
Operating Temperature-Min -55.0  Cel
Operating Temperature-Max 125.0  Cel
Organization 64MX72
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA208,11X19,40
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Refresh Cycles 8192.0
Supply Current-Max 1.75  Amp
Supply Voltage-Nom (Vsup) 1.8  V
Supply Voltage-Min (Vsup) 1.7  V
Supply Voltage-Max (Vsup) 1.9  V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Pitch 1.0  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Additional Feature AUTO REFRESH