Part #: W3E64M16S-333SBI

Part Category: Memory ICs
Manufacturer: Microsemi Corp.
Description: DDR DRAM, 64MX16, 0.7ns, CMOS, PBGA60

SPECIFICATIONS

Mfr Package Description 10 X 12.50 MM, PLASTIC, BGA-60
Status Transferred
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.7  ns
JESD-30 Code R-PBGA-B60
Memory Density 1.073741824E9  bit
Memory IC Type DDR DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 6.7108864E7  words
Number of Words Code 64M
Operating Mode SYNCHRONOUS
Operating Temperature-Min -40.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 64MX16
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
Seated Height-Max 2.56  mm
Self Refresh YES
Supply Voltage-Nom (Vsup) 2.5  V
Supply Voltage-Min (Vsup) 2.3  V
Supply Voltage-Max (Vsup) 2.7  V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1.0  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Length 12.5  mm
Width 10.0  mm
Additional Feature AUTO/SELF REFRESH