Part #: W25Q16CLSNIG

Part Category: Memory ICs
Manufacturer: Winbond Electronics Corporation America
Description: Flash, 16MX1, PDSO8

SPECIFICATIONS

Mfr Package Description 0.150 INCH, GREEN, PLASTIC, SOIC-8
REACH Compliant Yes
EU RoHS Compliant Yes
China RoHS Compliant Yes
Status Discontinued
Type NOR TYPE
Sub Category Flash Memories
Clock Frequency-Max (fCLK) 50.0  MHz
Data Retention Time-Min 20
Endurance 100000.0  Write/Erase Cycles
JESD-30 Code R-PDSO-G8
JESD-609 Code e3
Memory Density 1.6777216E7  bit
Memory IC Type FLASH
Memory Width 1
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 8
Number of Words 1.6777216E7  words
Number of Words Code 16M
Operating Mode SYNCHRONOUS
Operating Temperature-Min -40.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 16MX1
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.75  mm
Serial Bus Type SPI
Standby Current-Max 5.0E-6  Amp
Supply Current-Max 0.018  Amp
Supply Voltage-Nom (Vsup) 3.0  V
Supply Voltage-Min (Vsup) 2.3  V
Supply Voltage-Max (Vsup) 3.6  V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 1.27  mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Write Protection HARDWARE/SOFTWARE
Length 4.9  mm
Width 3.9  mm