Part #: SCANSTA112SMX

Part Category: Microprocessors/Microcontrollers/Peripheral ICs
Manufacturer: Texas Instruments High-Performance Analog
Description: Microprocessor Circuit, CMOS, PBGA100
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SCANSTA112SMX SPECIFICATIONS

Mfr Package Description FBGA-100
Status NRFND
External Data Bus Width 0.0
JESD-30 Code S-PBGA-B100
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Terminals 100
Operating Temperature-Min -40.0  Cel
Operating Temperature-Max 85.0  Cel
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA100,10X10,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 235
Power Supplies 3.3
Qualification Status Not Qualified
Seated Height-Max 1.5  mm
Sub Category Other Microprocessor ICs
Supply Voltage-Nom 3.3  V
Supply Voltage-Min 3.0  V
Supply Voltage-Max 3.6  V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Length 10.0  mm
Width 10.0  mm

SCANSTA112SMX FEATURED EQUIVALENT PARTS


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Drop-In Replacement: Same function, same pinout, parametrically equivalent or better to the compared device.

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Status
SCANSTA112SM Manufacturer: Texas Instruments High-Performance Analog Replacement Type: Drop-In Replacement Status: ACTIVE

Description:

Microprocessor Circuit, CMOS, PBGA100
SCANSTA112SMX/NOPB Manufacturer: Texas Instruments High-Performance Analog Replacement Type: Drop-In Replacement Status: ACTIVE

Description:

Microprocessor Circuit, CMOS, PBGA100
SCANSTA112SM/NOPB Manufacturer: Texas Instruments High-Performance Analog Replacement Type: Drop-In Replacement Status: ACTIVE

Description:

Microprocessor Circuit, CMOS, PBGA100