Part #: NX25P16VSI

Part Category: Memory ICs
Manufacturer: Winbond Electronics Corporation America
Description: Flash, 16MX1, PDSO8
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NX25P16VSI SPECIFICATIONS

Mfr Package Description 0.208 INCH, PLASTIC, SOIC-8
REACH Compliant Yes
Status Discontinued
Type NOR TYPE
Clock Frequency-Max (fCLK) 25.0  MHz
JESD-30 Code S-PDSO-G8
JESD-609 Code e0
Memory Density 1.6777216E7  bit
Memory IC Type FLASH
Memory Width 1
Number of Functions 1
Number of Terminals 8
Number of Words 1.6777216E7  words
Number of Words Code 16M
Operating Mode SYNCHRONOUS
Operating Temperature-Min -40.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 16MX1
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Shape SQUARE
Package Style SMALL OUTLINE
Parallel/Serial SERIAL
Qualification Status Not Qualified
Seated Height-Max 2.16  mm
Supply Voltage-Nom (Vsup) 3.0  V
Supply Voltage-Min (Vsup) 2.7  V
Supply Voltage-Max (Vsup) 3.6  V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 1.27  mm
Terminal Position DUAL
Length 5.27  mm
Width 5.27  mm