Part #: NAND128R4A1AZA6F
Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 8MX16, 10000ns, PBGA55
Manufacturer: Micron Technology, Inc.
Description: Flash, 8MX16, 10000ns, PBGA55
SPECIFICATIONS
| Mfr Package Description | 8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, VFBGA-55 |
| EU RoHS Compliant | Yes |
| Status | Discontinued |
| Access Time-Max | 10000.0 ns |
| JESD-30 Code | R-PBGA-B55 |
| Memory Density | 1.34217728E8 bit |
| Memory IC Type | FLASH |
| Memory Width | 16 |
| Number of Functions | 1 |
| Number of Terminals | 55 |
| Number of Words | 8388608.0 words |
| Number of Words Code | 8M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Min | -40.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 8MX16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.05 mm |
| Supply Voltage-Nom (Vsup) | 1.8 V |
| Supply Voltage-Min (Vsup) | 1.7 V |
| Supply Voltage-Max (Vsup) | 1.95 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 10.0 mm |
| Width | 8.0 mm |
