Part #: NAND128R4A1AZA6F

Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 8MX16, 10000ns, PBGA55

SPECIFICATIONS

Mfr Package Description 8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, VFBGA-55
EU RoHS Compliant Yes
Status Discontinued
Access Time-Max 10000.0  ns
JESD-30 Code R-PBGA-B55
Memory Density 1.34217728E8  bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Terminals 55
Number of Words 8388608.0  words
Number of Words Code 8M
Operating Mode ASYNCHRONOUS
Operating Temperature-Min -40.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 8MX16
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.05  mm
Supply Voltage-Nom (Vsup) 1.8  V
Supply Voltage-Min (Vsup) 1.7  V
Supply Voltage-Max (Vsup) 1.95  V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Length 10.0  mm
Width 8.0  mm