Part #: NAND08GW4B3AZB6T

Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 512MX16, 25000ns, PBGA63

SPECIFICATIONS

Mfr Package Description 9.50 X 12 MM,1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63
Status Discontinued
Access Time-Max 25000.0  ns
JESD-30 Code R-PBGA-B63
JESD-609 Code e0
Memory Density 8.589934592E9  bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Terminals 63
Number of Words 5.36870912E8  words
Number of Words Code 512M
Operating Mode ASYNCHRONOUS
Operating Temperature-Min -40.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 512MX16
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.2  mm
Supply Voltage-Nom (Vsup) 3.0  V
Supply Voltage-Min (Vsup) 2.7  V
Supply Voltage-Max (Vsup) 3.6  V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Length 12.0  mm
Width 9.5  mm