Part #: NAND01GW4B2BZA6E
Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 64MX16, 25000ns, PBGA63
Manufacturer: Micron Technology, Inc.
Description: Flash, 64MX16, 25000ns, PBGA63
SPECIFICATIONS
| Mfr Package Description | 9 X 11 MM, 1 MM HEIGHT, 0.80 PITCH, ROHS COMPLIANT, VFBGA-63 |
| Status | Transferred |
| Type | SLC NAND TYPE |
| Access Time-Max | 25000.0 ns |
| JESD-30 Code | R-PBGA-B63 |
| JESD-609 Code | e1 |
| Memory Density | 1.073741824E9 bit |
| Memory IC Type | FLASH |
| Memory Width | 16 |
| Number of Functions | 1 |
| Number of Terminals | 63 |
| Number of Words | 6.7108864E7 words |
| Number of Words Code | 64M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Min | -40.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 64MX16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.05 mm |
| Supply Voltage-Nom (Vsup) | 3.0 V |
| Supply Voltage-Min (Vsup) | 2.7 V |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 11.0 mm |
| Width | 9.0 mm |
