Part #: NAND01GW4B2BZA6E

Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 64MX16, 25000ns, PBGA63

SPECIFICATIONS

Mfr Package Description 9 X 11 MM, 1 MM HEIGHT, 0.80 PITCH, ROHS COMPLIANT, VFBGA-63
Status Transferred
Type SLC NAND TYPE
Access Time-Max 25000.0  ns
JESD-30 Code R-PBGA-B63
JESD-609 Code e1
Memory Density 1.073741824E9  bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Terminals 63
Number of Words 6.7108864E7  words
Number of Words Code 64M
Operating Mode ASYNCHRONOUS
Operating Temperature-Min -40.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 64MX16
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.05  mm
Supply Voltage-Nom (Vsup) 3.0  V
Supply Voltage-Min (Vsup) 2.7  V
Supply Voltage-Max (Vsup) 3.6  V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Length 11.0  mm
Width 9.0  mm