Part #: NAND01GW4A2DN6E
Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 64MX16, 12000ns, PDSO48
Manufacturer: Micron Technology, Inc.
Description: Flash, 64MX16, 12000ns, PDSO48
SPECIFICATIONS
Mfr Package Description | 12 X 20 MM, TSOP-48 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
China RoHS Compliant | Yes |
Status | Discontinued |
Access Time-Max | 12000.0 ns |
JESD-30 Code | R-PDSO-G48 |
JESD-609 Code | e3 |
Memory Density | 1.073741824E9 bit |
Memory IC Type | FLASH |
Memory Width | 16 |
Number of Functions | 1 |
Number of Terminals | 48 |
Number of Words | 6.7108864E7 words |
Number of Words Code | 64M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Min | -40.0 Cel |
Operating Temperature-Max | 85.0 Cel |
Organization | 64MX16 |
Package Body Material | PLASTIC/EPOXY |
Package Code | TSOP1 |
Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 260 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.2 mm |
Supply Voltage-Nom (Vsup) | 3.0 V |
Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Max (Vsup) | 3.6 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Tin (Sn) |
Terminal Form | GULL WING |
Terminal Pitch | 0.5 mm |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 18.4 mm |
Width | 12.0 mm |