Part #: NAND01GW3M2CZB5E

Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Memory Circuit, 128MX8, CMOS, PBGA137

SPECIFICATIONS

Mfr Package Description 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TFBGA-137
Status Discontinued
JESD-30 Code R-PBGA-B137
Memory Density 1.073741824E9  bit
Memory IC Type MEMORY CIRCUIT
Memory Width 8
Number of Functions 1
Number of Terminals 137
Number of Words 1.34217728E8  words
Number of Words Code 128M
Operating Mode ASYNCHRONOUS
Operating Temperature-Min -30.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 128MX8
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.2  mm
Supply Voltage-Nom (Vsup) 3.0  V
Supply Voltage-Min (Vsup) 2.5  V
Supply Voltage-Max (Vsup) 3.6  V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Length 13.0  mm
Width 10.5  mm
Additional Feature LPSDRAM IS ORGANISED AS 16M X 32