Part #: NAND01GW3M2CZB5E
Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Memory Circuit, 128MX8, CMOS, PBGA137
Manufacturer: Micron Technology, Inc.
Description: Memory Circuit, 128MX8, CMOS, PBGA137
SPECIFICATIONS
| Mfr Package Description | 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TFBGA-137 |
| Status | Discontinued |
| JESD-30 Code | R-PBGA-B137 |
| Memory Density | 1.073741824E9 bit |
| Memory IC Type | MEMORY CIRCUIT |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Terminals | 137 |
| Number of Words | 1.34217728E8 words |
| Number of Words Code | 128M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Min | -30.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 128MX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.2 mm |
| Supply Voltage-Nom (Vsup) | 3.0 V |
| Supply Voltage-Min (Vsup) | 2.5 V |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL EXTENDED |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Length | 13.0 mm |
| Width | 10.5 mm |
| Additional Feature | LPSDRAM IS ORGANISED AS 16M X 32 |
