Part #: NAND01GR3B2CZA6F

Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 128MX8, 25000ns, PBGA63

SPECIFICATIONS

Mfr Package Description 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, VFBGA-63
EU RoHS Compliant Yes
Status Transferred
Type SLC NAND TYPE
Sub Category Flash Memories
Access Time-Max 25000.0  ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B63
Memory Density 1.073741824E9  bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Sectors/Size 1K
Number of Terminals 63
Number of Words 1.34217728E8  words
Number of Words Code 128M
Operating Mode ASYNCHRONOUS
Operating Temperature-Min -40.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 128MX8
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA63,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.05  mm
Standby Current-Max 5.0E-5  Amp
Supply Current-Max 0.02  Amp
Supply Voltage-Nom (Vsup) 1.8  V
Supply Voltage-Min (Vsup) 1.7  V
Supply Voltage-Max (Vsup) 1.95  V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit NO
Length 11.0  mm
Width 9.0  mm