Part #: NAND01GR3B2CZA1T

Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 128MX8, PBGA63

SPECIFICATIONS

Mfr Package Description 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63
Status Discontinued
JESD-30 Code R-PBGA-B63
Memory Density 1.073741824E9  bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 63
Number of Words 1.34217728E8  words
Number of Words Code 128M
Operating Mode ASYNCHRONOUS
Operating Temperature-Min 0.0  Cel
Operating Temperature-Max 70.0  Cel
Organization 128MX8
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Seated Height-Max 1.05  mm
Supply Voltage-Nom (Vsup) 1.8  V
Supply Voltage-Min (Vsup) 1.7  V
Supply Voltage-Max (Vsup) 1.95  V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Length 12.0  mm
Width 9.5  mm