Part #: NAND01GR3B2BZA1E

Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 128MX8, 30ns, PBGA63

SPECIFICATIONS

Mfr Package Description 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-63
REACH Compliant Yes
EU RoHS Compliant Yes
Status Discontinued
Sub Category Flash Memories
Access Time-Max 30.0  ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B63
JESD-609 Code e1
Memory Density 1.073741824E9  bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Sectors/Size 1K
Number of Terminals 63
Number of Words 1.34217728E8  words
Number of Words Code 128M
Operating Mode ASYNCHRONOUS
Operating Temperature-Min 0.0  Cel
Operating Temperature-Max 70.0  Cel
Organization 128MX8
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA63,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.05  mm
Standby Current-Max 5.0E-5  Amp
Supply Current-Max 0.015  Amp
Supply Voltage-Nom (Vsup) 1.8  V
Supply Voltage-Min (Vsup) 1.7  V
Supply Voltage-Max (Vsup) 1.95  V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit NO
Length 12.0  mm
Width 9.5  mm