Part #: NAND01GR3A2CZD6E
Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 128MX8, 30ns, PBGA55
Manufacturer: Micron Technology, Inc.
Description: Flash, 128MX8, 30ns, PBGA55
SPECIFICATIONS
| EU RoHS Compliant | Yes |
| Status | Discontinued |
| Type | SLC NAND TYPE |
| Sub Category | Flash Memories |
| Access Time-Max | 30.0 ns |
| Command User Interface | YES |
| Data Polling | NO |
| JESD-30 Code | R-PBGA-B55 |
| Memory Density | 1.073741824E9 bit |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Sectors/Size | 8K |
| Number of Terminals | 55 |
| Number of Words | 1.34217728E8 words |
| Number of Words Code | 128M |
| Operating Temperature-Min | -40.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 128MX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | FBGA |
| Package Equivalence Code | BGA55,8X12,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Qualification Status | Not Qualified |
| Ready/Busy | YES |
| Standby Current-Max | 5.0E-5 Amp |
| Supply Current-Max | 0.02 Amp |
| Supply Voltage-Nom (Vsup) | 1.8 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 mm |
| Terminal Position | BOTTOM |
| Toggle Bit | NO |
