Part #: NAND01GR3A0CZB1E

Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 128MX8, 35ns, PBGA63

SPECIFICATIONS

Mfr Package Description 9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-63
EU RoHS Compliant Yes
Status Discontinued
Type SLC NAND TYPE
Access Time-Max 35.0  ns
JESD-30 Code R-PBGA-B63
Memory Density 1.073741824E9  bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 63
Number of Words 1.34217728E8  words
Number of Words Code 128M
Operating Mode ASYNCHRONOUS
Operating Temperature-Min 0.0  Cel
Operating Temperature-Max 70.0  Cel
Organization 128MX8
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.2  mm
Supply Voltage-Nom (Vsup) 1.8  V
Supply Voltage-Min (Vsup) 1.7  V
Supply Voltage-Max (Vsup) 1.95  V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Length 11.0  mm
Width 9.0  mm