Part #: N64S830HAS22I
Part Category: Memory ICs
Manufacturer: ON Semiconductor L.L.C.
Description: Standard SRAM, 8KX8, CMOS, PDSO8
Manufacturer: ON Semiconductor L.L.C.
Description: Standard SRAM, 8KX8, CMOS, PDSO8
N64S830HAS22I SPECIFICATIONS
| Mfr Package Description | 0.150 INCH, GREEN, MS-012, SOIC-8 |
| REACH Compliant | Yes |
| EU RoHS Compliant | Yes |
| China RoHS Compliant | Yes |
| Status | Active |
| Sub Category | SRAMs |
| Clock Frequency-Max (fCLK) | 20.0 MHz |
| I/O Type | SEPARATE |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e3 |
| Memory Density | 65536.0 bit |
| Memory IC Type | STANDARD SRAM |
| Memory Width | 8 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Ports | 1, (3 LINE) |
| Number of Terminals | 8 |
| Number of Words | 8192.0 words |
| Number of Words Code | 8K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Min | -40.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 8KX8 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | SOP |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.75 mm |
| Standby Current-Max | 4.0E-6 Amp |
| Standby Voltage-Min | 2.3 V |
| Supply Current-Max | 0.01 Amp |
| Supply Voltage-Nom (Vsup) | 3.0 V |
| Supply Voltage-Min (Vsup) | 2.5 V |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27 mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Length | 4.9 mm |
| Width | 3.9 mm |
