Part #: N25Q512A13G1240E
Part Category: Memory ICs
Manufacturer: Micron Technology, Inc.
Description: Flash, 512MX1, PBGA24
Manufacturer: Micron Technology, Inc.
Description: Flash, 512MX1, PBGA24
N25Q512A13G1240E SPECIFICATIONS
| Mfr Package Description | TBGA-24 |
| REACH Compliant | Yes |
| EU RoHS Compliant | Yes |
| China RoHS Compliant | Yes |
| Status | Discontinued |
| Type | NOR TYPE |
| Clock Frequency-Max (fCLK) | 108.0 MHz |
| Data Retention Time-Min | 20 |
| Endurance | 100000.0 Write/Erase Cycles |
| JESD-30 Code | R-PBGA-B24 |
| JESD-609 Code | e1 |
| Memory Density | 5.36870912E8 bit |
| Memory IC Type | FLASH |
| Memory Width | 1 |
| Number of Functions | 1 |
| Number of Terminals | 24 |
| Number of Words | 5.36870912E8 words |
| Number of Words Code | 512M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Min | -40.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 512MX1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TBGA |
| Package Equivalence Code | BGA24,5X5,40 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 1.2 mm |
| Serial Bus Type | SPI |
| Standby Current-Max | 5.0E-4 Amp |
| Supply Current-Max | 0.015 Amp |
| Supply Voltage-Nom (Vsup) | 3.0 V |
| Supply Voltage-Min (Vsup) | 2.7 V |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1.0 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Write Protection | HARDWARE/SOFTWARE |
| Length | 8.0 mm |
| Width | 6.0 mm |
