Part #: M471B5673EH1-CF8

Part Category: Memory ICs
Manufacturer: Samsung Semiconductor Division
Description: DDR DRAM Module, 256MX64, CMOS

SPECIFICATIONS

Mfr Package Description HALOGEN FREE AND ROHS COMPLIANT, SODIMM-204
EU RoHS Compliant Yes
Status Discontinued
Access Mode DUAL BANK PAGE BURST
JESD-30 Code R-XDMA-N204
Memory Density 1.7179869184E10  bit
Memory IC Type DDR DRAM MODULE
Memory Width 64
Number of Functions 1
Number of Ports 1
Number of Terminals 204
Number of Words 2.68435456E8  words
Number of Words Code 256M
Operating Mode SYNCHRONOUS
Operating Temperature-Min 0.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 256MX64
Package Body Material UNSPECIFIED
Package Code DIMM
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 3.8  mm
Self Refresh YES
Supply Voltage-Nom (Vsup) 1.5  V
Supply Voltage-Min (Vsup) 1.425  V
Supply Voltage-Max (Vsup) 1.575  V
Surface Mount NO
Technology CMOS
Temperature Grade OTHER
Terminal Form NO LEAD
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Length 67.6  mm
Width 30.0  mm
Additional Feature AUTO/SELF REFRESH