Part #: M471B5673EH1-CF8
Part Category: Memory ICs
Manufacturer: Samsung Semiconductor Division
Description: DDR DRAM Module, 256MX64, CMOS
Manufacturer: Samsung Semiconductor Division
Description: DDR DRAM Module, 256MX64, CMOS
SPECIFICATIONS
| Mfr Package Description | HALOGEN FREE AND ROHS COMPLIANT, SODIMM-204 |
| EU RoHS Compliant | Yes |
| Status | Discontinued |
| Access Mode | DUAL BANK PAGE BURST |
| JESD-30 Code | R-XDMA-N204 |
| Memory Density | 1.7179869184E10 bit |
| Memory IC Type | DDR DRAM MODULE |
| Memory Width | 64 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Terminals | 204 |
| Number of Words | 2.68435456E8 words |
| Number of Words Code | 256M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 256MX64 |
| Package Body Material | UNSPECIFIED |
| Package Code | DIMM |
| Package Shape | RECTANGULAR |
| Package Style | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Seated Height-Max | 3.8 mm |
| Self Refresh | YES |
| Supply Voltage-Nom (Vsup) | 1.5 V |
| Supply Voltage-Min (Vsup) | 1.425 V |
| Supply Voltage-Max (Vsup) | 1.575 V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Form | NO LEAD |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 67.6 mm |
| Width | 30.0 mm |
| Additional Feature | AUTO/SELF REFRESH |
