Part #: K6L1008V2C-TB70
Part Category: Memory ICs
Manufacturer: Samsung Semiconductor Division
Description: Standard SRAM, 128KX8, 70ns, CMOS, PDSO32
Manufacturer: Samsung Semiconductor Division
Description: Standard SRAM, 128KX8, 70ns, CMOS, PDSO32
K6L1008V2C-TB70 SPECIFICATIONS
Mfr Package Description | 8 X 20 MM, TSOP1-32 |
REACH Compliant | Yes |
Status | Discontinued |
Sub Category | SRAMs |
Access Time-Max | 70.0 ns |
I/O Type | COMMON |
JESD-30 Code | R-PDSO-G32 |
JESD-609 Code | e0 |
Memory Density | 1048576.0 bit |
Memory IC Type | STANDARD SRAM |
Memory Width | 8 |
Number of Functions | 1 |
Number of Terminals | 32 |
Number of Words | 131072.0 words |
Number of Words Code | 128K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Min | 0.0 Cel |
Operating Temperature-Max | 70.0 Cel |
Organization | 128KX8 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | TSOP1 |
Package Equivalence Code | TSSOP32,.8,20 |
Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Qualification Status | Not Qualified |
Seated Height-Max | 1.2 mm |
Standby Voltage-Min | 2.0 V |
Supply Current-Max | 0.035 Amp |
Supply Voltage-Nom (Vsup) | 3.3 V |
Supply Voltage-Min (Vsup) | 3.0 V |
Supply Voltage-Max (Vsup) | 3.6 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | TIN LEAD |
Terminal Form | GULL WING |
Terminal Pitch | 0.5 mm |
Terminal Position | DUAL |
Length | 18.4 mm |
Width | 8.0 mm |