Part #: K6F8008V2M-RF55
Part Category: Memory ICs
Manufacturer: Samsung Semiconductor Division
Description: Standard SRAM, 1MX8, 55ns, CMOS, PDSO44
Manufacturer: Samsung Semiconductor Division
Description: Standard SRAM, 1MX8, 55ns, CMOS, PDSO44
K6F8008V2M-RF55 SPECIFICATIONS
| Mfr Package Description | 0.400 INCH, REVERSE, TSOP2-44 |
| REACH Compliant | Yes |
| Status | Discontinued |
| Access Time-Max | 55.0 ns |
| JESD-30 Code | R-PDSO-G44 |
| Memory Density | 8388608.0 bit |
| Memory IC Type | STANDARD SRAM |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Terminals | 44 |
| Number of Words | 1048576.0 words |
| Number of Words Code | 1M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Min | -40.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 1MX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TSOP2-R |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 240 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.2 mm |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Supply Voltage-Min (Vsup) | 3.0 V |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.8 mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Length | 18.41 mm |
| Width | 10.16 mm |
