Part #: K6F2016U4D-FF70
Part Category: Memory ICs
Manufacturer: Samsung Semiconductor Division
Description: Standard SRAM, 128KX16, 70ns, CMOS, PBGA48
Manufacturer: Samsung Semiconductor Division
Description: Standard SRAM, 128KX16, 70ns, CMOS, PBGA48
K6F2016U4D-FF70 SPECIFICATIONS
Mfr Package Description | 6 X 7 MM, 0.75 MM PITCH, FBGA-48 |
Status | Discontinued |
Sub Category | SRAMs |
Access Time-Max | 70.0 ns |
I/O Type | COMMON |
JESD-30 Code | R-PBGA-B48 |
JESD-609 Code | e0 |
Memory Density | 2097152.0 bit |
Memory IC Type | STANDARD SRAM |
Memory Width | 16 |
Number of Functions | 1 |
Number of Terminals | 48 |
Number of Words | 131072.0 words |
Number of Words Code | 128K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Min | -40.0 Cel |
Operating Temperature-Max | 85.0 Cel |
Organization | 128KX16 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA |
Package Equivalence Code | BGA48,6X8,30 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Qualification Status | Not Qualified |
Seated Height-Max | 1.2 mm |
Standby Current-Max | 2.0E-6 Amp |
Standby Voltage-Min | 1.5 V |
Supply Current-Max | 0.035 Amp |
Supply Voltage-Nom (Vsup) | 3.0 V |
Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Max (Vsup) | 3.3 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN LEAD |
Terminal Form | BALL |
Terminal Pitch | 0.75 mm |
Terminal Position | BOTTOM |
Length | 7.0 mm |
Width | 6.0 mm |