Part #: IBM041816CBLBC-22
Part Category: Memory ICs
Manufacturer: IBM Microelectronics
Description: DDR SRAM, 1MX18, 2.1ns, CMOS, PBGA153
Manufacturer: IBM Microelectronics
Description: DDR SRAM, 1MX18, 2.1ns, CMOS, PBGA153
IBM041816CBLBC-22 SPECIFICATIONS
| Mfr Package Description | BGA-153 |
| Status | Discontinued |
| Sub Category | SRAMs |
| Access Time-Max | 2.1 ns |
| Clock Frequency-Max (fCLK) | 455.0 MHz |
| I/O Type | COMMON |
| JESD-30 Code | R-PBGA-B153 |
| JESD-609 Code | e0 |
| Memory Density | 1.8874368E7 bit |
| Memory IC Type | DDR SRAM |
| Memory Width | 18 |
| Number of Functions | 1 |
| Number of Terminals | 153 |
| Number of Words | 1048576.0 words |
| Number of Words Code | 1M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 1MX18 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Equivalence Code | BGA153,9X17,50 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2.679 mm |
| Standby Current-Max | 0.2 Amp |
| Standby Voltage-Min | 2.38 V |
| Supply Current-Max | 0.625 Amp |
| Supply Voltage-Nom (Vsup) | 2.5 V |
| Supply Voltage-Min (Vsup) | 2.375 V |
| Supply Voltage-Max (Vsup) | 2.625 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | BALL |
| Terminal Pitch | 1.27 mm |
| Terminal Position | BOTTOM |
| Length | 22.0 mm |
| Width | 14.0 mm |
| Additional Feature | PIPELINED ARCHITECTURE |
