Part #: H5TC4G63CFR-PBA

Part Category: Memory ICs
Manufacturer: SK Hynix
Description: DRAM Module, 256MX16, CMOS, PBGA96

SPECIFICATIONS

Mfr Package Description FBGA-96
REACH Compliant Yes
EU RoHS Compliant Yes
China RoHS Compliant Yes
Status Discontinued
Access Mode MULTI BANK PAGE BURST
JESD-30 Code R-PBGA-B96
Memory Density 4.294967296E9  bit
Memory IC Type DRAM MODULE
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 2.68435456E8  words
Number of Words Code 256M
Operating Mode SYNCHRONOUS
Operating Temperature-Min 0.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 256MX16
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2  mm
Self Refresh YES
Supply Voltage-Nom (Vsup) 1.35  V
Supply Voltage-Min (Vsup) 1.283  V
Supply Voltage-Max (Vsup) 1.45  V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Length 13.0  mm
Width 7.5  mm
Additional Feature AUTO/SELF REFRESH